16 results
Three Dimensional Analyses of Degradation in PEMFCs
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- Journal:
- Microscopy and Microanalysis / Volume 23 / Issue S1 / July 2017
- Published online by Cambridge University Press:
- 04 August 2017, pp. 962-963
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- July 2017
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In situ,Real-time Environmental SEM Imaging System Development for Water Splitting Reaction Using a Dynamic Light Illumination System
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- Journal:
- Microscopy and Microanalysis / Volume 22 / Issue S3 / July 2016
- Published online by Cambridge University Press:
- 25 July 2016, pp. 814-815
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- July 2016
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Influence of indium addition on electromigration behavior of solder joint
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- Journal:
- Journal of Materials Research / Volume 26 / Issue 20 / 28 October 2011
- Published online by Cambridge University Press:
- 19 September 2011, pp. 2624-2631
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- 28 October 2011
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Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints
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- Journal of Materials Research / Volume 26 / Issue 3 / 14 February 2011
- Published online by Cambridge University Press:
- 11 February 2011, pp. 467-474
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- 14 February 2011
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Whisker growth from an electroplated zinc coating
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- Journal of Materials Research / Volume 25 / Issue 11 / November 2010
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2175-2182
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- November 2010
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Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging
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- Journal of Materials Research / Volume 22 / Issue 7 / July 2007
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1975-1986
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- July 2007
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Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders
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- Journal:
- Journal of Materials Research / Volume 18 / Issue 11 / November 2003
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2540-2543
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- November 2003
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The Development and Commercialization of Lead-Free Soldering
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- Journal:
- MRS Bulletin / Volume 26 / Issue 11 / November 2001
- Published online by Cambridge University Press:
- 03 May 2012, pp. 880-884
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- November 2001
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Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating
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- Journal of Materials Research / Volume 15 / Issue 4 / April 2000
- Published online by Cambridge University Press:
- 31 January 2011, pp. 884-891
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- April 2000
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Formation and structure of carbon nanocage structures produced by polymer pyrolysis and electron-beam irradiation
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- Journal of Materials Research / Volume 14 / Issue 11 / November 1999
- Published online by Cambridge University Press:
- 31 January 2011, pp. 4266-4273
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- November 1999
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Wetting and interface microstructure between Sn–Zn binary alloys and Cu
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- Journal:
- Journal of Materials Research / Volume 13 / Issue 10 / October 1998
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2859-2865
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- October 1998
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Interfaces in β–SiC whiskers/6061 aluminum composites
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- Journal of Materials Research / Volume 8 / Issue 10 / October 1993
- Published online by Cambridge University Press:
- 03 March 2011, pp. 2569-2576
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- October 1993
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Direct Bonding Method of Aluminum to Stainless Steel by Pressure Casting of Aluminum
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- Journal:
- MRS Online Proceedings Library Archive / Volume 314 / 1993
- Published online by Cambridge University Press:
- 15 February 2011, 209
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- 1993
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Properties and microstructure of continuous oxynitride glass fiber and its application to aluminum matrix composite
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- Journal of Materials Research / Volume 8 / Issue 1 / January 1993
- Published online by Cambridge University Press:
- 18 February 2016, pp. 178-186
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- January 1993
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Reliability Factors in Ceramic/Metal Joining
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- Journal:
- MRS Online Proceedings Library Archive / Volume 314 / 1993
- Published online by Cambridge University Press:
- 15 February 2011, 51
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- 1993
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Interface Structure of Si3N4 Matrix Composite with Nano-Meter Scale Sic Particles
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- Journal:
- MRS Online Proceedings Library Archive / Volume 287 / 1992
- Published online by Cambridge University Press:
- 25 February 2011, 335
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- 1992
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